At present, the widely used laser marking machine models on the market include fiber laser marking machine, ultraviolet laser marking machine and CO2 laser marking machine. These three types of models can cover many types of product marking packaging applications. It is also the current mainstream laser marking equipment.
For example, the price of laser ultraviolet laser marking machine is almost three times that of laser fiber laser marking machine. Then, below, let’s explain the difference between fiber and UV laser marking machine:
- Laser and principle
Ultraviolet laser marking machine: Manufactured with 355nm ultraviolet laser. The machine uses three-stage intracavity frequency doubling technology to compare with infrared lasers. Ultraviolet light has a small focus point, which can greatly reduce the mechanical deformation and processing of materials. The thermal effect is small.
Fiber laser marking machine: use 1064nm wavelength.
Regarding the laser wavelength, generally the shorter the wavelength, the smaller the laser spot size, and the higher the accuracy. The smaller the heat-affected zone formed during processing, the better the processing effect. There are also differences between the processing method of using a laser ultraviolet laser marking machine and other laser marking equipment. Generally, for CO2 laser marking machine and fiber laser marking machine, it is the physical marking method of laser. The UV laser marking machine adopts chemical treatment methods, mainly photochemical reactions. The difference between the methods is that the physical laser processing method is mainly to process the surface of the product and material, while the chemical processing method of the laser is that the laser can be used to penetrate into the interior of the product material.
2, the characteristics of UV laser marking machine:
In terms of wavelength, the wavelength of ultraviolet laser is shorter than that of visible light, so it is invisible to the naked eye. Although you can’t see these laser beams, these short waves can make the UV laser focus correctly, maintain its fine circuit characteristics, and maintain excellent positioning accuracy.
Another important factor is that the lower the temperature of the workpiece, the high-energy photons present in the ultraviolet light can diffract the ultraviolet laser from large PCB circuit boards, from standard materials such as FR4 to high-frequency ceramic composite materials, including polyimide. But these six lasers include excimer laser (wavelength 248nm), infrared laser (wavelength 1064nm) and two CO2 lasers (providing various materials, such as flexible PCB materials. Ultraviolet laser (Nd: YAG, 355 nm) is a rare laser , Has a consistent absorption rate in some materials.
UV laser marking machine has high absorptivity when calibrating resin and copper, and has proper absorptivity when processing glass. Only expensive excimer lasers (with a wavelength of 248 nm) can obtain good total absorption when processing these main materials. The variability of this material and UV inverters are ideal for various PCB materials in many industrial applications, from high-end processes such as substrates and circuit wiring to pocket-sized embedded chips.
The computer system of the UV laser marking machine directly transfers the computer-aided design data to the processing board means that no intermediates are needed in the board production process. Coupled with the ability of UV focusing, the UV laser system can achieve unique solutions and repeat positioning. It can be said that the positioning is accurate, which is also one of the requirements of the circuit board industry.
- Application areas:
Fiber laser marking machine: High cost performance, basically suitable for laser marking on a variety of metal surfaces. Due to the penetration of the beam, it is not suitable for marking materials.
Cosmetics, video tapes and other polymer material packaging bottles surface standard samples have fine effects, marking cleaning, ink spraying without pollution; use flexible printed circuit boards. Standard, cutting; silicon wafer micro-hole, blind hole processing. Among them, 80% of the data cables and adapter marks on the market come from the company’s UV laser marking machine.
